Improved method for nanofabrication of irregular structures
Categories |
Nanotechnology, Chemistry & Materials, Micro & Opto Electronics, Electronic / Optic / Electrooptic / Photonic, Polymers, Processes, Molecular Electronics, Nano Materials and Nano Structures |
Development Stage |
Proof of concept |
Patent Status |
Patent application filed in the United States |
Highlights
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In nanofabrication there is a problem with integrating self-assembling materials into existing manufacturing strategies to enable molecular-level process control and the ability to produce useful architectures.
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Films of block copolymers can be directed to assemble on chemically patterned substrates into predictable and desirable morphologies and orientations that augment and enhance those produced by the lithographic process.
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Although this process has been shown to produce extremely accurate and exact patterns and is the only method that has been demonstrated to achieve non-regular device-oriented geometries used in the fabrication of integrated circuits or servo patterns on hard drives, there is a problem with inserting these materials in order to replicate non-regular structures such as long lines, sharp bends and jogs, T-junctions and more.
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Blends of diblock copolymers and homopolymers have been employed to overcome this problem, but have their own limitations.
Our Innovation
The incorporation of a supramolecular block into a conventional block copolymer provides additional structural flexibility that enables accurate replication of non-regular structures.
Figure. (a) Illustration of the nature of the dynamic block copolymer: morphology changing with addition of supramolecular monomers according to local conditions. (b) Simulation results showing defect-less replication of a rectangular pattern using the dynamic block copolymers.
Key Features
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Enables highly accurate replication of non-regular structures
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Enables simultaneous replication of different types of non-regular structure with one composition of material
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Limits number of defects
Development Milestones
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Seeking funding for ongoing research
The Opportunity
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The integrated circuit market is forecast to eclipse $300 billion in 2013 because of demand in smart phones, media tablets, and automotive systems.